BGA (Ball Grid Array) Repairing Services @Sanyog Electronics:

BGA Component Removal

We have solutions for all your BGA (Green Chip) rework and repair needs. We're equipped with top-of-the line BGA rework systems and a staff of engineers and operators with in-depth knowledge and experience at the intricate process of BGA rework.

We offer a wide variety of services including BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites.

BGA Component Removal and Replacement -
We have top-line BGA rework systems and a fully trained staff of engineers and operators to support you. This combination provides you with a repeatable process with every project meeting the highest quality standards.

We're recognized as an industry leader in BGA services. Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework services. BGA rework is a challenge, but not for the experts at Sanyog Electronics.

One of the problems with BGA devices is that it is not possible to view the soldered connections using optical methods. Therefore sufficient heat must be applied to ensure that all the balls in the grid melt sufficiently for every joint to be satisfactorily made.

The joints cannot be tested fully by checking the electrical performance. It is possible that the joint may not be adequately made and that over time it will fail. The only satisfactory means of inspection is to use X-ray inspection as this means of inspection is able to look through the device at the soldered joint beneath.It is found that once the heat profile for the solder machine is set up correctly, the BGA devices solder very well and few problems are encountered, thereby making BGA assembly possible for most applications.

Ball Grid Array, BGA rework:
It is not easy to rework boards containing BGAs unless the correct equipment is available. If a BGA is suspected as being faulty, then it is possible to remove the device. This is achieved by locally heating the device to melt the solder underneath it.

In the BGA rework process, the heating is often achieved removed in a specialised rework station. This comprises a jig fitted with infrared heater, a thermocouple to monitor the temperature and a vacuum device for lifting the package. Great care is needed to ensure that only the BGA is heated and removed. Other devices nearby need to be affected as little as possible otherwise they may be damaged.

BGA repair:
Once removed, the BGA can be replaced with a new one. Occasionally it may be possible to refurbish or repair a BGA that has been removed. This BGA repair may be an attractive proposition if the chip is expensive and it is known to be a working device once removed. Undertake a BGA repair it needs to have the solder balls replaced. This BGA repair can be undertaken using some of the small ready-made solder balls that are manufactured and sold for this purpose. Sanyog Electronics has a vast experience both in repairing and also in replaceing the faulty BGA connections.

Kindly give us a call at 9860406079 from Pune and Pimpri Chinchwad for all your laptop repairing needs.

Support

Office Address

Contact No:020 27440175
Address: Shop No 15,Harshal Heights, Opp.Gavde Petrol Pump, Pimpri-Chinchwad Link Road, Pune.
Mobile: 9860406079
E-mail: agrawal.sanjay1@gmail.com